Molybdenum Copper Substrates For Heat Dissipation

1. Information Of Molybdenum Copper Substrates For Heat Dissipation:

Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It is a material with excellent thermal conductivity, high electrical connectivity and processability. It is usually prepared by high-temperature hot-pressing process. The bottom of the molybdenum-copper substrate is molybdenum material, and the surface is covered with a layer of high-conductivity copper material. It is usually used as heat dissipation and electrical connectors for power devices IGBT.

2. The specifications of molybdenum copper substrate can be customized according to actual needs.

Common specifications are as follows:

Thickness: 0.1-3.0mm
Size: 30mm x 30mm, 25mm x 15mm, 50mm x 50mm, etc.

3. Performance Parameters Of Molybdenum Copper Substrates For Heat Dissipation:

Thermal conductivity: high thermal conductivity, the thermal conductivity is 140-180 W/(m·K).

Electrical Connectivity: Good electrical connectivity that can withstand high current densities and high electron flow rates.

Machinability: Easy to process and braze, enabling complex shapes and high-precision manufacturing.

4. Advantage Of Molybdenum Copper Substrates For Heat Dissipation:

Excellent heat dissipation: The molybdenum copper substrate has excellent thermal conductivity, which can quickly transfer heat to the radiator, thereby reducing the operating temperature of power devices and improving reliability and stability.

High electrical connectivity: The copper layer can provide good electrical connectivity and can withstand high current density and high electron flow rate, thereby improving the operating efficiency of power devices.

Good machinability: The molybdenum-copper substrate is easy to process and braze, and can realize complex shapes and high-precision manufacturing, which can meet the needs of various power devices.

5. Use Of Molybdenum Copper Substrates For Heat Dissipation:

Molybdenum copper substrate is mainly used in heat dissipation and electrical connection of power device IGBT. It can be used in various power electronic equipment, such as frequency converters, AC-DC converters, inverters, etc. At the same time, it is also widely used in aerospace, electronic communication, military and other fields.

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Shaanxi Peakrise Metal Co., Ltd. is an rich experienced tungsten,molybdenum, tantalum, niobium, titanium,zirconium,nickel non-ferrous metal production enterprise,main products include tungsten-copper alloy, molybdenum-copper alloy, tungsten-molybdenum alloy, high specific gravity tungsten alloy, tantalum alloy,niobium alloy,titanium alloy and other more than 100 kinds of products.In 2010, with the surge in export sales of products in this industry, we began to focus on foreign trade export business,provide high-quality non-ferrous metal products for the international market.After years of development,at present, it has become a comprehensive non-ferrous metal production enterprise integrating manufacturing and processing, material research and development, product testing, and stock inventory.The development of nearly ten years reminds us that high-quality products and services are always our top priority,at the same time, we continue to expand into new fields and provide high-quality products and services for more domestic and global customers.Products are exported to Taiwan, Ukraine, South Korea, the United States, Australia, Germany, Iran and other countries, and have established long-term good cooperative relations with customers. Our products are highly recognized and evaluated by customers.

Peakrise Metal  has a variety of production equipment, such as intermediate frequency sintering furnace, vacuum arc melting furnace, laser cutter,plasma electron beam melting furnace, vacuum annealing furnace, various rolling mills, wire drawing machines, plasma welding rooms, lathes, milling machines, sawing machines, drilling machines, Shears, Stamping Equipment, Cutting Equipment, Grinders, Straightening Machines, CNC, etc.

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